As the ASML lithography systems get bigger, the (detrimental) impact of smaller particles on the system's performance increases. Protecting particles in the micro- and submicrometer range from landing on critical surfaces has therefore become a key challenge in managing the lifecycle of ASML machines. Active means of protection have been deployed, in particular, in manufacturing and service tools. These tools are developed by the Tooling Technology Departments in Development & Engineering (D&E) within ASML, which is where this internship will take place.
Because the number of contamination protection tools has risen sharply over the past few years particularly related to EUV systems, there is a need to study how the different tooling technical solutions compare against each other and how they impact the specifications placed on the ASML Lithography systems on particles and defectivity.
Key deliverables include:
This is a bachelor or master internship, also suitable for a graduation internship, for minimum 6 months (preferably 12 months), minimum 4 days per week (3 days on-site). The start date of this internship is as soon as possible.
To be a match for this internship, you:
Other requirements you need to meet
This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.
ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company.
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