Thermal Hardware Development Internship

HP

Thermal Hardware Development Internship

Description -

HP Barcelona site has the charter for the development of leading-edge 3D printers for a broad range of markets and needs worldwide. In this context, we look for a proactive, hands-on and technically solid person with genuine interest in technology and innovation. She/he will be integrated in a multidisciplinary team within the R&D department dedicated to thermal control and energy management in 3D printers. The position provides an exciting opportunity for an engineering student interested in starting his professional career in a high-tech, international environment, in an area full of exciting learning and innovation possibilities.

Responsibilities:

  • Support to senior engineers on research and development of thermal processes, mechanical systems and other hardware solutions for energy management and thermal control of 3D printers, along with the algorithms and workflows required to operate them.
  • Design, execute and document tests for thermal management and/or other HW areas on printer development: test plans, design and assembly of test setups, test execution and data verification.
  • Setup, handling, calibration and operation of high-end instruments like thermo-cameras, thermistors, data logging devices, etc.
  • Test data collection, analysis, interpretation and reporting of results.
  • Development, empirical validation and retrofit of analytical models for energy/thermal analysis. Proficiency on computerized tools (e.g. Matlab, Maxima, Python, Excel, etc.), desirable CAE fundamentals (FEA, CFD, etc.)
  • Design of tools and setups for testing, and support to printer components development.

Job requirements:

  • BsC (Grade) or Master student on Mechanical, Aeronautical/Aerospace or similar engineering grade. Minimum finished 3 years of the grade required
  • Thermal, energy management and mechanical/hardware design profile
  • Strong analytical capabilities. Proficiency in mathematics, statistics and data analysis.
  • Advanced Programming skills.
  • Academic expedient will be valued during the selection.

Critical competencies:

  • Fast-learning and growth mindset
  • High Technical competence and engineering orientation
  • Self-organization and responsibility
  • Flexibility, adaptability and capacity to operate in a very dynamic environment
  • Teamwork skills
  • Fluent in English

Experience our benefits

Being part of HP means access to an international community with lots of growth opportunities within the company, professional development resources, networking opportunities, while enjoying in a great atmosphere making an impact. 

  • Flexibility to keep a good work life balance. 
  • Lunch in the cafeteria 
  • Love sports? Then take advantage of our sports center (indoor and outdoor); gym, squash courts, tennis courts, basketball courts and with 25+ regular coordinated activities / sports , such as HIIT training, squash, basketball and yoga 
  • A Young employee Network (YEN) which host fun events on a regular basis, such as “beer bust” Fridays at different venues including the beach in the summertime.
  • Diverse, continued internal growth and career opportunities. Including HP’s own learning platform and LinkedIn Learning. 
  • Women, Pride, Young employees, Multicultural, Sustainability and Disability! Just a few of our fantastic global business networks you can get involved with locally.We also dedicate time and resources to contribute with our community through Corporate Volunteering activities, including our onsite HP Charity day 
  • Our HP Barcelona campus’ in Sant Cugat del Vallès is an inspiring diverse and inclusive venue to meet, engage and co-create with your colleagues from all over the world: flexible work, collaborative spaces, sports and leisure areas.

Job -

Administration

Schedule -

Full time

Shift -

No shift premium (Spain)

Travel -

Relocation -

EEO Tagline - 

HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.

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Confirmed 12 hours ago. Posted 30+ days ago.

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