You will join the Tables & Clamps Analysis group within ASML’s Development and Engineering department in Veldhoven. This team focuses on the design and optimization of wafer tables used in high-precision systems. In this internship, you will contribute to improving wafer flatness at the nanometer scale through modeling and optimization. Your work will directly support the performance of advanced lithography machines. This Mechanical Engineering | Applied Physics internship: wafer flatness optimization offers a unique opportunity to combine physics, mechanics, and numerical methods in a real-world application.
In this internship you will develop and improve a modeling and optimization approach for wafer table design. You will explore how stiffness and load distribution influence wafer flatness and translate insights into practical solutions. The goal is to create a reliable and usable method that supports engineering decisions. Your main responsibilities will be:
This is a master non thesis/thesis internship for 6 months, minimum 4 days per week (3 days on-site). The start date of this internship is as of September 2026.
To be suitable for the internship, you:
Other requirements you need to meet:
ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.
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