Requirements:
- Degree or MSc Degree in Mechanical, Material, Manufacturing or Electronic engineering or Equivalent
- At least 10 years working experience in wafer bumping and WLCSP. Added advantages if having good knowledge in advanced packages (Panel Level Packaging, 2.5D/3D packaging), Flip-Chip and wire bond packages assembly.
- Knowledgeable in DOE, Process Control System and technical problem solving methodology
- Possess strong leadership, project management and critical thinking skills
- Can communicate effectively in Mandarin and English; both in verbal and written
- Have a strong semiconductor product and bumping/assembly/test process methodology understanding & trouble shooting skill.
- Excellent leadership and motivational skills. Possess strong interpersonal skills and have the ability to communicate and present across all levels of organization.
- Proven ability and flexibility to lead successfully in a complex, cross-functional multinational environment
- Ability to work independently, be hands-on and expected to dive into technical details
- Self-sufficient and resourcefulness in acquiring the appropriate technical skills and knowledge from resources across the globe
Responsibilities/Job Descriptions:
- Work with NXP Global team to drive subcon site transfer / 2nd source qual.
- Drive qualification for bumping and assembly quality improvement, VE and subcon’s PCN projects (Including BOM/Process Change; Building Move; Production Floor Re-layout, Material Supplier Mfg Site Move; New Equip Model, etc).
- Own gap analysis, CZ/qual plan, safe launch plan and overall qualification timeline for site transfer, quality improvement, VE and subcon’s PCN projects.
- NPI/NTI early involvement to ensure no quality excursion during ramp at subcon.
- Technical lead the quality (CQC/CSET/Severe Incident) improvement with quality team
- Technical lead onsite root cause investigation, analysis and resolution for quality/yield excursion in subcon
- Review subcon CQC / 8D & proposed actions to prevent recurrence
- Review & provide technical inputs for CIP (Continuous Improvement Plan) in subcon assembly
- Update Bond Diagram, Package Kits, Bumping/Assembly Shop Oder Flow and working with Product Engineer on PC parts linkage
- Act as a Change Action Board (CAB) member to review and approve NPI/NTI and all changes in subcon
More information about NXP in Greater China...
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