Nexperia

About the role

The Molding Process Development Staff/Principal Engineer is responsible for developing and optimizing advanced molding processes to support New Product Introductions (NPIs), package roadmap enablement, and volume ramp-up. This role is critical in ensuring robust process integration, material compatibility, yield enhancement, and product quality across a wide range of semiconductor packages including QFN, BGA, SIP, Power Packages, and Fan-Out technologies. The engineer will lead feasibility studies, process qualifications, and cross-functional implementation of new molding solutions to meet customer and internal manufacturing requirements.

What you will do:

1. Molding Process Development & Innovation

• Lead development of transfer molding, compression molding, or overmold processes for leadframe, substrate, and advanced packages.
• Evaluate and introduce new molding materials (compounds, adhesives, tapes) for improved reliability and performance.
• Define and optimize critical process parameters such as mold pressure, temperature, clamp force, cure profile, and resin flow behavior.

2. NPI Enablement & Technology Transfer

• Support new package/platform introductions from concept to HVM, ensuring manufacturability, robustness, and cost effectiveness.
• Collaborate with R&D, Product Engineering, Equipment, and Quality teams on new product qualifications (e.g. TSSOP, VSSOP, DHVQFN ).
• Perform process characterization, failure mode analysis, and root cause investigations during engineering builds.

3. Material-Process-Design Interaction

• Work closely with compound and mold tool vendors to optimize material selection and design integration.
• Analyze interactions between package design, mold tool design, and material properties to prevent warpage, bleed, delamination, and mold defects.
• Ensure compatibility with downstream processes (laser marking, de-tape, trim & form).

4. Yield, Reliability & Quality Improvement

• Implement process improvements to reduce defects such as mold voids, flash, bleed, wire sweep, or delamination.
• Use DOE, FMEA, and Six Sigma methodologies to drive data-based decisions and process robustness.
• Support qualification of molding processes for automotive and high-reliability markets (e.g., AEC-Q100, JEDEC standards).

5. Technical Documentation & Knowledge Sharing

• Generate technical reports, SOPs, Control Plans, and PFMEAs as part of process release.
• Present findings and development status to cross-functional stakeholders and customers as required.
• Mentor junior engineers and provide technical leadership in molding technologies.

6. Industry Benchmarking & Equipment Evaluation

• Benchmark best-in-class molding technologies, equipment, and materials from global suppliers.
• Evaluate new molding equipment (e.g., Towa, Hanmi, ASM, Panasonic) for adoption into high-volume manufacturing.
• Partner with vendors to customize mold tooling and automation for specific package needs.

What you will need:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, or Semiconductor Engineering.
• 8–12+ years of experience in semiconductor assembly, specifically in molding process development for leadframe/substrate-based packages.
• Hands-on experience with mold process setup, compound behavior, tool design, and interaction with package materials.

Skills & Competencies:

• Deep knowledge of transfer and compression molding processes and their limitations.
• Experience in solving complex molding defects with root cause tools (e.g., DOE, FMEA, 8D, etc.).
• Familiar with compound characterization (e.g., gel time, viscosity, Tg, filler content) and package reliability requirements.
• Strong project leadership, communication, and cross-functional collaboration skills.
• Ability to manage multiple projects and deliver on tight timelines in fast-paced environments.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.