Nexperia

About the role

The Package Singulation Development Staff Engineer will lead and support the development, optimization, and industrialization of singulation processes (e.g., saw) for advanced semiconductor packages. This role is responsible for delivering robust singulation solutions for New Product Introduction (NPI), driving cost-effective, high-yielding processes, and supporting technology roadmap execution for backend assembly operations.

What you will do:

• Lead the development and optimization of singulation processes (blade saw, laser dicing, mechanical punch, plasma dicing) for new and existing package types (e.g., QFN, DFN, BGA, WLCSP).
• Define and validate singulation design rules, dicing lane requirements, and process parameters to meet package quality, dimensional accuracy, and reliability targets.
• Evaluate and qualify materials (e.g., tape, adhesive, saw blades), equipment platforms, and process flows to enable high-throughput and cost-effective singulation.
• Collaborate with design, R&D, NPI, and equipment vendors to drive tool selection, trials, and qualification of new singulation technologies.
• Conduct process capability studies (Cp, Cpk), DOE, and failure analysis to resolve process issues and ensure process robustness.
• Lead efforts on singulation-related defect reduction, including package chipping, delamination, edge crack, burrs, and saw mark optimization.
• Develop and maintain process documentation: standard operating procedures (SOPs), control plans, FMEAs, and process specifications.
• Support ramp-up to production, and ensure smooth technology transfer from development to manufacturing teams.
• Interface with global cross-functional teams (assembly operations, quality, reliability, product engineering) to ensure successful implementation.
• Contribute to roadmap strategy for next-generation singulation technologies aligned with miniaturization and high-density packaging trends.

What you will need:

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electronics, Mechatronics, or related field.
• Minimum 8–10 years of experience in semiconductor backend process development, with at least 5 years focused on singulation or dicing technologies.
• In-depth knowledge of saw/dicing technologies, equipment (DISCO, Accretech, ADT, Synova, etc.), and process-material interaction.
• Hands-on experience with process characterization, equipment qualification, SPC, and structured problem solving (e.g., 8D, DMAIC, A3).
• Familiarity with advanced packaging trends, such as ultra-thin QFN, SiP, WLCSP, or Fan-Out packaging.
• Strong analytical skills and proficiency in tools such as Minitab, JMP, AutoCAD, or SolidWorks.
• Excellent interpersonal and communication skills; able to lead projects across multiple departments.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.