Job description:

  • Reporting to Director, Assembly Engineering
  • Knowledge of various equipment mold technology: Leaded, Leadless, In-line.
  • Responsible as Mold UG leader (Chair) for Molding across A&T sites.
  • Liaise with factory engineering teams and ensure cross-site coordination.
  • Drive quality, cost and productivity improvement initiatives, may work in partnership with other functional groups i.e. IE /QA /Package Innovation Global Procurement etc
  • Able review detailed product requirements & generate equipment technical specifications.
  • Knowledge in materials properties on molding compound.
  • Manage and aligned the Equipment Life Cycle Management (LCM) with Package Roadmap.
  • Supervise equipment benchmarking at backend sites.
  • Work with key Equipment OEM headquarters for total NXP support.
  • Other responsibilities may be assigned over time as needed and applicable.

Job Experience:

  • Process or Equipment engineer with 10 years’ experience or more.
  • Equipment automation /integration related experience will be added advantage.
  • Project management experience will be an advantage.
  • Previous direct project work with suppliers on quality or productivity improvement projects.
  • Strong Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems.
  • Cross cultural work experience

Education:

  • Bachelor’s Degree in Engineering or Science in technical discipline.
  • 6 sigma green belt or above certified recommended.

Working style:

  • Good communication skills, knowledge in multi-languages will be an advantage.
  • Self-motivated working style & able to work independent, delivery of KPI’s expected.
  • Possess good collaboration skills & ability to promote strong teamwork across multi-cultural teams.
  • Ability to travel as need arises to support cross site projects

More information about NXP in Malaysia...

#LI-6650

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Confirmed 19 hours ago. Posted 30+ days ago.

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