Senior Principal Design Engineer

Nexperia

POSITION OVERVIEW:

The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with high power chip technology development team to design and develop state-of-the-art technology and deliver world-class high-power chips on the market.

KEY RESPONSIBILITIES:

  • Responsible to build technology platform for power device (IGBT/FRD) design and new technology development to meet customer requirement in a manufacturable and cost-effective way
  • Responsible to improve the device overall performance for the existing products, in particular, to improve the device reliability and robustness
  • Performing TCAD process and device simulations, and layout design
  • Creating and maintaining design rules and generation rules when required using controlled procedures
  • Responsible for engineering device test (static, dynamic, reliability, etc) and data analysis, part of manually testing might be involved
  • Responsible to guide and work with chip and other function teams to meet timely deliveries
  • Train and advance the skills of existing technical employees to expand their capability and responsibility
  • Experience of IGBT design for EV/HEV application preferred
  • Encourage and manage the process of producing technical publications and invention patents.

SKILLS/COMPETENCIES

(Top 3-7 most important/critical competencies needed for the job both soft and hard skills):

Hard Skills:

  • Hand-on experience in power device design and technology development, fine geometry trench and thin wafer technology are necessary, 12” experience is a plus
  • Proficiency in TCAD process and device simulation
  • Understanding of power device physics, fabrication and characterization principles.
  • Knowledge and experience in design for reliability and robustness of power devices.
  • Ability to address design and engineering issues and to provide suitable solutions
  • More than 8 years working experience in IGBT (or FRD) design and/or processing
  • Proficient in reading English literature and writing in English

Soft Skills:

  • Leadership skills in building and leading project teams in a global, intercultural environment– “exemplified engagement”.
  • Master’s degree or above, major in Microelectronics or semiconductor related
  • Good Communication skills in both oral and written English

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

Nexperia is an Equal Opportunity/Affirmative Action Employer.

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Confirmed 6 hours ago. Posted 30+ days ago.

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