Microchip

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People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

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Job Description:

Reporting to the Manager Process Engineering, you will be part of the Process Engineering team responsible for the processes of wire-bonding as well as die-bonding of Surface Acoustic Wave (SAW) based filters and oscillators. As a Process Engineer, Backend Process Engineering, you need the willingness to act on you own authority to support the production and to optimize and further develop your processes. You will also be involved in supporting the Process Engineering team in the field of maintenance, process control and analysis as well as the development of new packaging technologies.

What’s attractive about this opportunity?

This position will expose you to a wide variety of process engineering challenges related to backend manufacturing technologies for Surface Acoustic Wave filters and oscillators with a focus on Al-wire-bonding and die-bonding technologies.

More details on the expectations and responsibilities in this position:

• Responsibility for the processes of Al-wire-bonding and die-bonding of SAW packages.
• Contribution to the requirements of new and optimized equipment and material specifications and related tooling.
• Support of the Process Engineering team and the production regarding yield improvement, process development and optimization, as well as failure analysis.
• Strong technical interest and skills to maintain and repair manufacturing equipment and to increasingly take over responsibilities for processes.
• Willingness and ability to collaborate with other relevant departments to ensure high productivity in Process Engineering.

Requirements/Qualifications:

• Degree (master’s preferred) in Engineering
• Background / experience in wire-bonding technology

Competencies

• Experience in backend manufacturing technologies.
• Good technical and electronical understanding to support the manufacturing equipment.
• Good German language skills in speaking and writing; effective English language skills to communicate with suppliers and comprehend technical literature.

Travel Time:

0% - 25%