Introduction
As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Your Role and Responsibilities
IBM Research at Albany Nanotech is currently seeking engineers in the area of process technology for semiconductors and related devices, including wafer polishing, wafer grinding, wafer edge trimming with emphasis in wafer bonding and thinning / finishing applications for the integration of various bonding processes such as permanent insulator-insulator wafer bonding, hybrid metal/insulator wafer bonding, temporary adhesive wafer bonding, and wafer debonding process. These process technologies are critical for enablement of applications for 2.5D and 3D integration for chiplet-based integrated circuits, backside power delivery network for transistor powering, and stacking of transistors. The hired candidates will have significant expertise and understanding of the fundamental principles in one or more of these process areas. Some of the job responsibilities include maintaining and qualifying state of the art semiconductor 300mm process equipment and/or developing processes from an early concept stage into a mature element that enables a leading-edge technology.
Job responsibilities include
You must be willing to work in Albany, NY, with occasional day travel to Yorktown Heights, NY, and infrequent overnight travel to various locations worldwide. (<10%)
This position requires a B.S. degree in Chemical or Electrical Engineering, Materials Science or Engineering, Chemistry, Physics, or a related field, with relevant industrial experience preferred.
Required Technical and Professional Expertise
Preferred Technical and Professional Expertise
5+ year of experience with related experience in polishing, grinding, and wafer thinning
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