MTS IC-Advance Packaging CAD Engineer

AMD

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

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MTS IC-Advance Packaging CAD Engineer

THE ROLE: 

The candidate is an experienced Package CAD MTS Engineer that has excellent communication & project management skills and can complete the design task with least supervision. He/she must be able to work on a fast phase environment and collaborate well with others.

THE PERSON: 

The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder. 

KEY RESPONSIBILITIES:

  • Contribute to the development and enhancements of automations to improve design cycle time and quality.
  • Support scripting requirements of the team to automate design methodologies.
  • Experience in EDA coding or PnR coding
  • Develop Design frameworks for the advance package designs and flow pipe clean.
  • Development and deployment of DRC decks that includes PVS, ICV and Calibre decks.
  • Support Installation, Tracking and resolution of tools and technology file issues.

PREFERRED EXPERIENCE:

  • Strong experience in TCL, Python, Perl, and SKILL coding
  • Strong knowledge on Power BI and VBA
  • Very good insights on ML/AI techniques and project level implementation skills
  • Knowledge on using CAD Layout tools such as Cadence SIP, APD 17.4, XPD, ICC2, Packaging verifications tools or Silicon Physical Layout Software is plus.
  • Knowledge on Semiconductor package designs is plus.
  • Strong commitments to the deliverables

ACADEMIC CREDENTIALS:

  • Masters in electrical engineering, Computer Engineering, or Engineering Science with 8+Yrs o fexp

#LI-SR4

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

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Confirmed 3 hours ago. Posted 30+ days ago.

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