NXP

Description:

ATI-PI-API (Advance Technology Innovation- Packaging Innovation-Assembly Process Innovation) Tianjin department is focusing on IC package/process development. Major projects include development work on lead frame based and laminate-based packages.

This position is a Packaging Intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

• New packaging technology development
• New package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)

Qualification:

• Bachelor or above degree students, master's degree preferred
• Major in: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
• Fluent in both Mandarin and English.

More information about NXP in Greater China...