Microsoft

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.

The Data Processing Unit (DPU) team brings together state-of-the-art software and hardware expertise to create a highly programmable and high-performance ASIC with the capability to efficiently handle large data streams. Thanks to its integrated design, this solution empowers teams to operate with increased agility and deliver significantly superior performance compared to CPU-based alternatives.

Central to our mission is development of platforms for Azure Datacenters based on our highly programmable data processing chip (DPU). As a Hardware Board Design Engineer, you will be responsible for the design & development of hardware platforms that shall be used for various applications like Storage, Compute & AI.

We are looking for a Senior Hardware Design Engineer to join our team!

• Design & develop high-speed boards based on the architecture specification document and deliver detailed HW functional specification document
• Work with cross-functional teams to review the hardware functional specification document and ensure the design meets all the requirements.
• Work with manufacturing team to review the design and ensure the DFM requirements are met
• Work with Diagnostics & HW Test engineers to review the test plans and ensure there is no test coverage gap
• Thorough testing and validation of hardware products to ensure compliance with specifications, requirements and quality standards.
• Perform root cause analysis and troubleshooting of hardware defects in a timely manner and implement preventive measures for future occurrences

Required/minimum qualifications

• Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience.
• 4+ years of Experience in any of the Schematics Design & PCB CAD tools like Cadence Orcad, Altium Designer, Mentor Graphics PADS & Cadence Allegro
• 4+ years of Experience on high-speed interfaces like PCIe/CXL, DDR, USB, UFS, SERDES
• 4+ years of Experience on Signal & Power Integrity concepts
• 4+ years of Experience working in lab environment and using different equipment like DSO, Power supplies, BERT & Traffic generators

Other Qualifications

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Additional or preferred qualifications

• Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
• Experience working with CM/ODM, Fault isolation, & RCCAs
• Experience working with Thermal Chamber & Protocol analyzers like PCIe, DDR, USB, UFS, SPI & I3C/I2C
• Familiarity with Scripting languages like Phython/ Perl

Silicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $158,400 - $258,000 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

Microsoft will accept applications for the role until November 14th, 2025.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

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