Onsemi

Job Summary:

• The Package Development Engineer is responsible for developing, optimizing, and sustaining advanced packaging processes, specifically focusing on wafer saw and laser grooving process technologies. This role involves collaboration with cross-functional teams to ensure high-quality and efficient manufacturing processes for semiconductor devices.

Requirements:

• Education
  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• Experience
  • Minimum of 5 years of experience in semiconductor package assembly process development.
  • Experience in Project Management is a plus.
• Skills
  • In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
  • Proven track record in process development and efficient use of methodologies.
  • Strong analytical and problem-solving skills.
  • Excellent communication and collaboration abilities.
  • Familiar with Project Management concepts and tools.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.