National University of Singapore

Job Description:

Job Description

The Singapore Hybrid Integrated Next-Generation µ-Electronics (SHINE) research centre in National University of Singapore (NUS) is looking for applicants for a Research Engineer position. This position supports the development of advanced packaging strategies for co-integrated electronic–photonic systems (EIC–PIC), with an emphasis on system-level simulation, layout optimization, and performance validation. The successful candidate will work across disciplines to investigate how thermal effects, packaging geometries, and material properties influence the electrical and optical behavior of densely integrated systems. Special focus will be placed on understanding the impact of localized heating on signal integrity in optical waveguides, and on enabling compact, scalable form factors for high-performance photonic modules.

Responsibilities will involve:

1. Perform multi-physics simulations (thermal, electrical, mechanical) to guide packaging and interconnect design.

2. Analyze thermal effects on signal integrity in silicon photonic.

3. Support the co-design of electronic-photonic layouts, including optical alignment strategies and thermal isolation zones.

4. Assist in the integration of PICs and EICs within compact packaging structures using modelling.

5. Correlate simulation outputs with experimental data from prototype assemblies.

6. Prepare technical documentation, figures, and datasets to support reporting, publications, and internal reviews.

(Interested applicants should send their curriculum vitae via email to eleykl@nus.edu.sg).

Qualifications

• A bachelor’s or higher degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Candidate with experience in microelectronic research, characterisation, metrology, electrical testing, thermal modelling, photonic circuit simulation using Lumerical or Zemax, and/or advanced IC packaging.
• Knowledge in thermos-optic effects, waveguide theory, and co-packaged optics is preferred.
• Strong analytical and problem-solving skills.
• Self-driven and possesses effective communication skills including writing and presenting.
• Ability to work in a multidisciplinary research environment.
• Open to fixed term contract.

More Information

Location: Kent Ridge Campus

Organization: College of Design and Engineering

Department : Electrical and Computer Engineering

Employee Referral Eligible: No

Job requisition ID : 29455