Qualcomm

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

Overview

This is a design position in the I/O Pad design team working on delivering quality low power I/O IP in state of art CMOS/FinFET/GAA technology nodes for Qualcomm's advanced mobile baseband, Auto, IOE/IOT & consumer products. Join QCT's IP team in designing and implementing I/Os for Qualcomm's next generation chipsets. The team is responsible for the complete design lifecycle, from system-level concept to tape out and post-silicon support, of advanced digital and mixed-signal ASIC designs in advanced CMOS/FinFET/GAA processes.

Responsibilities

• Mixed-signal transistor level circuit design for General Purpose I/O (GPIO) and Custom I/Os, including specialty I/O such as eMMC, SDC, I2C, SLIMBus, RFFE, SPMI, Soundwire and multi-level voltage I/Os using low voltage transistors.
• Circuit design & Simulations for I/O circuitry
• Work with layout, packaging and system engineers to meet design specifications.
• Work closely with modeling & characterization team to provide front & back end models for their design.

The ideal candidate would possess the following qualifications

• Proven track record of mixed-signal transistor level circuit design in the field of I/Os.
• Recent experience in I/O designs for wireless devices including Low-Power I/O design.
• Solid understanding of related CMOS, FinFET and GAA process technology issue.
• Familiar with I/O design methodology & flow, Calibration, JTAG design requirements, understanding of analog circuitry.
• Familiarity with ASIC flow: Synopsys libraries, LEF, CPF, UPF, Place & Route & understanding of top level verification flow.
• Familiar with Power & Signal Integrity and understanding of signal switching, noise & design issues.
• Experience in Cadence Virtuoso (Layout, Schematic, Simulation)
• Experience/skills in the following areas are highly valued: SKILL, PYTHON & TCL scripting, writing Verilog/VHDL, IBIS modeling, characterization and generating .LIBs.
• Familiarity with package/board constraints is a plus
• Proven successful track record as a team player with an engineering team.
• Excellent communication skills and ability to work across multiple teams in multiple locations.
• Possess accountability and ownership.
• All levels of CMOS, FinFET & GAA IC development experience.

Educational Requirements

• Required: Master's in Electrical or Computer Engineering

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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