Nexperia

About the role

The Wire Bond Process Development Staff Engineer is responsible for developing, optimizing, and industrializing wire bonding processes for advanced semiconductor packages. This role focuses on delivering robust, high-yield, and cost-effective solutions for new product introductions (NPIs), sustaining activities, and roadmap technologies across various package platforms (e.g., QFN, DFN, BGA, SiP, HVQFN).

What you will do:

• Lead the development, evaluation, and qualification of wire bonding processes (Au, Cu, Ag, Al wires; ball/stitch/bump bonding) to meet product and package requirements.
• Define and optimize bonding parameters, bond pad design rules, and tooling specifications to achieve reliable interconnects.
• Work with R&D, NPI, Design, and Reliability teams to define wire bond strategies during package and product design.
• Conduct DOE, capability studies (Cp/Cpk), and FA to drive process improvements and resolve defects such as NSOL, heel crack, pad lift, or wire sweep.
• Collaborate with equipment vendors (K&S, ASM, Palomar, Hesse, etc.) to select and qualify bonding tools, capillaries, and advanced interconnect solutions.
• Lead material evaluations including wire type, molding compound interaction, die attach, and leadframe/material stack impact.
• Support design of experiments (DOE) to characterize new bonding schemes and ensure process robustness for volume ramp-up.
• Own and maintain process documentation: Control plans, Process FMEAs, WI/SOPs, process flow maps, and validation reports.
• Drive continuous improvement initiatives related to bonding cycle time, process yield, and cost reduction.
• Collaborate with manufacturing teams and OSATs to ensure smooth process transfer and scalable deployment.

What you will need:

• Bachelor’s or Master’s Degree in Materials Science, Electronics, Mechanical, Mechatronics, or a related engineering field.
• 8+ years of experience in semiconductor backend process development, with at least 5 years focused on wire bond technology.
• Solid knowledge of wire bonding mechanics, intermetallic formation, ultrasonic energy optimization, and bonding material behavior.
• Hands-on experience with bonding equipment (e.g., K&S ICONN, 8000 series, ASM Eagle, Hesse BJ series).
• Familiarity with bondability challenges, pad metallization, leadframe design, and thin die handling.
• Skilled in using tools such as JMP, Minitab, CAD/DFM tools, and performing root cause analysis (e.g., 8D, A3, FMEA).
• Strong cross-functional leadership, communication, and technical documentation skills.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.