At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

  • Should have B-Tech/M-tech with 5 Years to 15 Years relevant experience.

4-14years

  • Very good knowledge on SCAN/ATPG/JTAG/MBIST
  • Experience with one or more chip tape out that includes chip ATE bring up.
  • Experience on gate level simulation with no timing and timing (SDF) simulations (ATPG/MBIST/JTAG)
  • Experience in Test structures for DFT, IP integration, ATPG fault models, test point insertion, coverage improvement techniques.
  • Experience in scan insertion techniques at block level and chip top level.
  • Experience on Memory BIST generation, insertion, verification on RTL/Netlist level.
  • Good knowledge and understanding in Analog PHY and Analog Macro tests.
  • Good knowledge and understanding on JTAG for IEEE 1149.1/IEEE1149.6 standards.
  • Good knowledge on test mode timing constraints
  • Good knowledge about running block level and chip STA flows.
  • Cross domain knowledge to resolve DFT issues with design, synthesis, physical design, STA team.
  • Proficiency in industry standard tools for scan insertion, ATPG, MBIST and JTAG (preferable Cadence/Tessent tools)
  • Experience with post-silicon bring up and debug on ATE.
  • Good knowledge on Perl/Tcl scription skills
  • Very good team player capabilities and excellent communication skills to work with a variety of teams across the global organization.
  • High sense of responsibility and ownership within the team for successful tape out and post-silicon bring up of project.
  • Should have B-Tech/M-tech with 5 Years to 15 Years relevant experience.

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Confirmed 16 hours ago. Posted 30+ days ago.

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