Role Summary:
- leading and managing all the activities of Assembly Process in ATBK, working together with various groups (particularly Manufacturing, Equipment, and Packaging Innovation) to meet business objectives.
Job Responsibility:
- Management Team member of NXP Bangkok to drive site decision aligning with NXP values and mission.
- Drive process standardization, best practices, and talent retention & growth for organization sustainability
- Establishing & maintaining the production standard work meeting process control requirements
- Own & drive area KPIs to meet performance target (Safety, Quality, Delivery, Costs, Yield)
- Define, develop and establish process capabilities, strategy and roadmap
- Develop a strategy to develop new capabilities or to overcome process constraints
- Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure
- Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront
- Constantly on the lookout for new material suppliers / new technology and capability
- Specifically on risk assessment and process flow optimization, playing the Integrator role of Assembly process from wafer to package finished good
- Ensure business continuity in process, working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
- Maintain a matrix on process capabilities and constraints
- Work with UG/Equipment counterpart on equipment benchmarking
Job Qualification:
- Bachelor Degree in relevant engineering fields
- 8+ Years of Experience in Semiconductor industry is mandatory
- Competent in NPI development, quality, or problem solving skill will be added advantage
- Experience with various DOE methodology, proficient in statistical tools for decision making, knowledgeable in JMP software or equivalent
- Knowhow in wire bond technology including bonding diagram analysis, Cu wire bonding, and engagement with equipment team on Wirebonder MTBA improvement
- Experience in running engineering teams in wire bond, die bond, or mold
- Strong leadership skills with good communication
- Excellent data analysis and data interpretation skills
- Ability to make sound data-driven decisions
- Hands on, strong ownership, and able to collaborate as team player
Key Competencies most required include:
- Drives Results
- Problem Solving
- Manages Ambiguity
- Collaborates
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