Micron

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR45961 ASIC Packaging – Senior or Principal Package Design Engineer

Are you enthusiastic about semiconductor package design and would you enjoy being part of a global team of experts? Then apply for the Senior/Principal Package Design Engineer position in the Global Design, Simulation, and Substrate team at Micron Technology. You will integrate high-performance ASICs and advanced semiconductor devices into innovative package solutions for various applications such as Mobile Computing, Automotive, Artificial Intelligence, Storage, and Cloud Computing. You will collaborate with silicon designers to develop optimized ASIC designs that integrate well into advanced package substrate and assembly manufacturing processes. You will join global cross-functional teams, including external subcontractors, to create package design databases including package stack-up, routing studies, substrate layout, wire bond diagrams, simulation, and other design documentation. You will leverage your skills and experience to deliver high-quality package designs on time that meet project requirements, specifications, and Assembly and vendor capabilities.

Responsibilities include, but are not limited to the following:

• Work with architects and chip/package leads to optimize ASIC design.
• Assess and compare ASIC package options and risks.
• Support ASIC package technology and IP (Intellectual Property) development.
• Provide design support for simulation analysis of thermal, mechanical, and electrical aspects.
• Support and contribute to the design group's continuous improvement efforts, such as:
• Global design alignment
• Package design rules and system development
• Package roadmaps
• Competitive analysis review
• Lead package and DFM (Design for Manufacturing) reviews and design setup.
• Generate and update documentation for package drawings, interposer drawings, and manufacturing drawings.
• Work with PCB (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.

Qualifications

We are looking for a qualified engineer with the following skills and experience:

• A PhD (preferred) or master's in electrical engineering.
• Five or more years (ideally 10-15 years) of industry experience within the following areas:
• Controller and/or Advanced Memory Substrate Design (flip chip / wire bond)
• PCB Design
• Signal/Power Integrity Analysis/Optimization
• Cadence and AutoCAD tools
• Assembly Process/Materials
• Assembly DOE (Design of Experiments) definition/management
• Product Engineering
• Quality and Reliability
• Outstanding computer skills and MS Office competence.
• A keen eye for detail and accuracy.
• Effective communication skills, both oral and written.
• A global perspective and the ability to work in a multicultural environment.
• Advanced knowledge of electrical circuits and how to read and interpret drawings and schematics.
• Ability to prioritize and manage multiple projects successfully.
• Willingness to travel as needed.

If you meet these qualifications and are excited about working on innovative semiconductor packaging projects, please apply today. We look forward to hearing from you!

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.