TW_Resident Engineer - Bosch semiconductor automotive products

Bosch

Benefits
Special Commitments

Company Description

Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch.

博世集團於1990 年開始在台灣營運,2006年10月整合台灣地區各事業單位,成立在台事業總部,命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展,目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。 在台灣,博世同時也致力於履行企業社會責任,長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年,台灣博世展開長期的「博世成就愛」社會公益計畫,並舉辦了數場提倡摩托車道路安全的校園宣導活動,同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。 台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活,在全球透過創新及激發熱情的產品與服務,提升人們的生活品質。簡言之,博世期許能「以科技成就生活之美 」。

Job Description

The resident engineer will be responsible for Bosch semiconductor automotive products assembled in Asia. Also, will act as an interface between the Bosch semiconductor assembly engineering group (AE/MFX-SO) and assembly and test subcontractors/ suppliers throughout the Asian region.

Quality:

  • To review and audit adherence of the processes qualified to Bosch requirements, especially Customer Process Flow, Process Control Plan, Machine qualification, SPC, Machine Logbooks, OCAP's (Out of Control Action Plans), etc.. To carry out Process Confirmation Checks.
  • To force the process and production engg to support detailed and structured process CIP
  • To provide frequent updates on all lots outside "Alarm Limits" or "Target Yields", "Lots on hold", and "Non-conforming or suspect material", supporting speedy release of the material.
  • To coordinate work with the subcontractor in investigating and resolving specific quality and process problems.
  • To force the technical RC analysis progress of customer returns and devices returned for analysis,
  • To monitor MRB and 8D-reports from the subcontractor, and the implementation of containment measures and permanent corrective actions from technical point of view
  • To participate in the Continuous Improvement Process both of Bosch and of the subcontractor, and in Engineering Teams concerned with Bosch qualified processes and products.

Engineering:

  • To monitor process and equipment changes, line or equipment moves, etc as defined in the Bosch documents "General Packaging Specification ".
  • To liaise with local development departments in the case of new BOM and packages,
  • To provide technical support for the successful production ramp-up of new device types and packages.
  • To support and co-ordinate implementation and execution of Bosch's specific projects directed by AE/MFX-SO, including cost-reduction projects.
  • To maintain occasional contact with materials and tool suppliers in the region.

Communications Partner:

  • Support daily communication between Bosch organization and the subcontractors on technical subjects.
  • To handle technical (quality and engineering) issues.
  • To maintain contact with the subcontractors at both engineering and management levels.

Logistics and Delivery:

  • To provide technical support in the case of technical constraints causing delivery problems, capacity bottlenecks, cycle time improvement, etc…
  • to support and to review technical solutions and process improvements.
  • To monitor the progress of qualification and engineering lots, reporting status immediately to Bosch, and striving to minimize the throughput times.

Documentation:

  • For the Product-defining documents "Detail Packaging Specification", to check that the up-to-date copies are correctly archived by the subcontractor. To follow up the speedy approval by the subcontractor of new and changed specifications.

Performance:

  • To chase up all quality performance reports provided by the subcontractor. (e.g. Yield, Cpk, MRB, etc.) to AE/MFX-SO.

General:

  • To support both Bosch and third party (customer) visit and audits.
  • Supports other subcontractors/suppliers during visits/audits or technical meetings
  • Responsible for KPIs like Yield, Incoming Quality and product reliability for assigned Bosch lines at various OSATs
  • To provide timely management updates on any critical information that may potentially affect Bosch’s business. This information could be strike, accidents, airport closures, planned line and equipment changes or moves, and changes in the organization.
  • To check that all other actions requested from the subcontractor by Bosch are correctly understood and carried out.

Qualifications

  • 3~5 years of professional process experience in assembly/packaging of semiconductor components
  • Experience with semiconductor assembly related manufacturing is necessary
  • Experience with MEMS is a plus
  • Problem solving skills and fluent English and Mandarin for efficient communication are mandatory-
  • Deep interest in addressing technical problems in the line in cooperation with OSATs
  • Work efficiently in international teams
  • Willingness to travel (mainly within Asia) as responsibility will exceed OSATs in TW
  • High level of self-motivation and self-initiative
  • Candidate is currently living in Kaohsiung would be more preferred
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Confirmed 11 hours ago. Posted 30+ days ago.

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