Hitachi ABB Power Grids

At Hitachi Energy our purpose is advancing a sustainable energy future for all. We bring power to our homes, schools, hospitals and factories. Join us and work with fantastic people, while learning and developing yourself on projects that have a real impact to our communities and society. Bring your passion, bring your energy, and be part of a global team that appreciates a simple truth: Diversity + Collaboration = Great Innovation

We are looking for a technical lead for process development of the new generation of devices, with the focus on wet etching and thin wafers (Wafer Thinning, Taiko Grinding, Spin Wet Etching). You are capable to establish new processes, solve complex problems in the production environment and provide new ideas by questioning of the existing solutions. You are able to establish successful internal and external collaborations and work persistently to achieve common targets. In close collaboration with R&D device development and process integration, you develop and execute the technology roadmap and continuous improvement projects. Our flexible work practices help you optimize personal and business performance while creating an environment where all employees can develop their skills and grow.

Your responsibilities

• Establishing and optimization of wafer thinning (including Taiko grinding), single- and batch wet etch semiconductor processes within BiMOS production (Wet Etch / Thinning area tools and related metrology) to gain better devices, yield and productivity
• Full involvement in introduction of the new generation of power devices on 200 mm Si and 150 mm SiC wafers in volume production
• Taking the process ownership for Wafer Thinning and other related processes and tools
• Evaluation of new materials, methods and technologies for the involved production areas
• Work closely together with Equipment and Maintenance Engineers to meet the production specifications and enhance process- and tool stability
• Responsibility for the development packages in cooperation with R&D and Product Engineering
• Definition, process qualification and tuning of the new and upgraded tools

Your background

• University degree in Physics, Chemistry, Engineering etc. or related experience in semiconductors
• More than 5 years of experience in semiconductor production environment in one or multiple areas: Wafer Thinning, Taiko grinding, Wet Etch (SAT/SST/single spin etcher)
• Knowledge of the specific power semiconductor applications like thin wafers (< 150 µm) and/or IGBT processing is a clear advantage
• Experience with production-oriented thinning tools is beneficial
• Experience with failure analysis and process control
• Know-how in optimization of processes and tools to gain favorable device properties, yield and productivity
• Fluent English, knowledge of German is a positive but not a requirement

More about us

Hitachi Energy is a global technology leader that is advancing a sustainable energy future for all. We serve customers in the utility, industry and infrastructure sectors with innovative solutions and services across the value chain. Together with customers and partners, we pioneer technologies and enable the digital transformation required to accelerate the energy transition towards a carbon-neutral future. We are advancing the world’s energy system to become more sustainable, flexible and secure whilst balancing social, environmental and economic value. Hitachi Energy has a proven track record and unparalleled installed base in more than 140 countries. Headquartered in Switzerland, we employ around 38,000 people in 90 countries and generate business volumes of approximately $10 billion USD. www.hitachienergy.com Interested in joining our team? If so, we look forward to receiving your full application (motivation letter, CV, references) only via our online careers tool. Hitachi Energy Switzerland Ltd. Peter Pankaczi Talent Acquisition

Publication date

2022-03-01

Reference Number

CH52727549_E1