Infineon

We are seeking an experienced Project Manager to lead and execute packaging projects within the semiconductor product and technology development lifecycle. You will be responsible for ensuring project milestones, quality, cost, and customer requirements are met—from concept through qualification and handover to manufacturing. This role requires close collaboration with cross-functional teams, strong project management skills, and hands-on experience in semiconductor packaging development. Ideal candidates possess a strong technical background, leadership in project execution, and the initiative to drive innovation and continuous improvement within a dynamic R&D environment.

Job Description

In your new role you will:

• Managing package development execution within product/technology development according to project milestone, quality & cost requirements.Project complexity could be from Class E up to Class C.
• Aligned with chip/system development, test engineering for all technical, cost and quality aspects during project phase.
• Support Package Definition group to ensure package platform complexity, product requirement, customer commitment are met.
• Problem solving and trouble shooting of development issues.
• Responsible for samples, qualification build-up & transfer into manufacturing engineering.
• Communication channel of dedicated project in BE to requestor (e.g.Project Owner, PJM of Product Line, Package group PCK of Product Line,BE Management, Steering committee).
• Responsible for regular KLUSA reporting and milestone release in NPI Tool
• Reporting project progress to Project Owner / PJM of PL and/or development board in BE OSAT

Your Profile

You are best equipped for this task if you have:

• Masters/Bachelor’s Degree in Engineering and Physical Science.
• At least 5 years above of relevant working experience and there of 4years of leading projects
• Experience in semiconductor R&D in packaging group and managing project
• Has very good project management knowledge in terms of project initiation, planning and closing including reporting and documentation
• Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency.
• Experience in analytical tool, e.g. Surface analysis, material characterization, DoE, D/PFMEA, 8D and simulation knowledge will be anadded advantage
• IP management, e.g. patent filing.
• Certification on PMP, IPMA C, 6SIGMA are value added

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

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