NXP

A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. An in-depth understanding Analog and digital circuits are required. The devices analyzed include new designs/products, low yield on existing products, qualification failures, and returns from customers.

The successful candidate will reproduce electrical failures in a lab environment and locate/characterize he defect or anomaly using a variety of electrical, optical, and physical techniques. Collaboration is expected with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing. FA results will be documented in formal failure analysis reports. Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior & deprocessing of the packaged device in order to identify the cause of failure. In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems.

The following is the BASIC job knowledge/requirements

• Engineering BS or MS degree aligned with Electric/Electronics or Applied Physics
• Good technical knowledge of digital and analog circuit fundamentals as well as an understanding of the underlying semiconductor device physics and behaviour.
• Lab bench testing using evaluation boards, lab tester and electrical test data interpretation.
• Understanding of semiconductor wafer processing.
• Specific experience of microcontrollers and their operation would be an advantage.
• Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc…
• Knowledge of UNIX, CADENCE and KNIGHTS software is desirable.
• Ability to work with chemicals, X-Ray, Electron and Ion Beam Tools

The following job experience would be a benefit/plus (but not requirement)

• Laboratory or wafer fab or similar manufacturing environment is a plus
• Microprobe measurement and analysis/test measurement knowledge.
• Fault Isolation techniques, including liquid crystal, EMMI, OBIRCH, etc.
• Familiar with the FA process flow and analysis techniques: SEM, EDX, X-ray, etc.
• Ability to deprocess devices using a variety of wet and dry chemistry methodologies.
• Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.

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