Qorvo

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

RESPONSIBILITIES:

• The primary job function will be to develop, optimize, and sustain processes used for semiconductor fabrication supporting GaAs, GaN, and acoustic wave technology.
• Provide support for back-end processes including wafer bonding and de-bonding, wafer thinning, singulation, and pick-and-place.
• Newly developed processes will transfer into high volume manufacturing requiring defect reduction, yield ramp activities, SPC, and cycle time reduction.

Work shift requirements: Tuesday-Saturday, 8 am to 5 pm, while supporting a factory which operates 24/7.

Physical requirements of position: The position involves working in a cleanroom environment with protective clothing. Some lifting and standing will be required.

QUALIFICATIONS:

• BS in Physics, Chemistry, Engineering, Materials, or other physical sciences.
• 5+ years of semiconductor processing experience is preferred.
• Demonstrated success in solving multidisciplinary problems.
• A grasp of semiconductor device fundamentals, including solid-state physics concepts, transistor characterization, the integration of multi-layer interconnects, and basic packaging techniques is required.
• Ability to use the scientific method in solving problems, including the design of experiments, statistical analysis of results, and reporting of findings.
• Must be able to work within a fast-paced team environment where problem solving occurs with the cooperation and support of multiple engineers.
• Excellent written, oral, and interpersonal communications skills are fundamental.
• Attention to detail and the ability to self-manage the completion of tasks with little supervision.

PREFERRED QUALIFICATIONS:

• Hands-on experience with fragile thinned wafers, dicing frames, cleaning of wafers with solvents and aqueous solutions, and the use of adhesives and ancillary materials for temporary bonding would be beneficial.

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This position is not eligible for visa sponsorship by the Company.

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.