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The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business. From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success. 

SUMMARY

  • The incumbent on this position makes decisions on administrative and operational matters of failure analysis and Reliability organizations and ensures effective achievement of objectives including failure analysis cycle times, Reliability Qualification planning and execution ensuring accuracy and thoroughness leading to first pass success.
  • Leads a team of highly technical failure analysis and Reliability engineers to resolve extremely complex failures where analysis and Reliability qualification of new products, existing products and ongoing process monitoring vehicles.
  • Responsible for training/educating failure analysis and reliability engineers on new techniques, methodologies and enable cross training to propagate best practices.
  • Participates with other senior managers to establish strategic plans and objectives.
  • Regularly interacts with internal and external customers. Interactions may involve controversial situations, negotiations, or influencing and persuading other senior level managers.
  • Demonstrates assertiveness leading to effective change management, employee performance engagement. Interacts regularly with the team soliciting inputs for efficiency improvements, failure analysis techniques development and failure resolution.
  • Responsible for multiple labs of Failure Analysis and Reliability, and report to HQ operation metrices in a weekly, Monthly and Quarterly.

RESPONSIBILITIES

  • Own end-to-end reliability tasks (plan, design, test, analysis, report) and demonstrate strong initiatives to go above and beyond. In addition, perform data modeling, producing key metrics such as MTTF, failure rates, safe operating conditions, and corresponding confidence bounds.
  • Develop methods, processes, procedures, and equipment that will improve the failure analysis process and/or reduce failures (Wet and Dry Chemical de-processing or parallel polishing will be used to reveal the defects, Micro probing and circuit understanding/debugging will be required to isolate the defects).
  • Demonstrated competence without supervision the operation and application of standard failure analysis tools, including: X-ray analysis, Acoustic Microscopy, Light Microscopy, Oscilloscopes, IR microscopy, OBIRCH, photon emission microscopy (PEM) and SEM/EDS analysis, and Focused Ion Beam methods.
  • Required to manage multiple teams of FA and Reliability engineers and technicians who work on rotating shifts or fixed assigned shifts including weekends.
  • Design and debug hardware for HTOL burn-in and Biased HAST boards for reliability qualification and evaluation.
  • Ability to perform Failure Analysis on IC’s to determine root causes and issue 8D failure analysis reports.
  • Work with R&D, design, process, package, and product engineers to qualify new process and package technologies and ensure quality of design performance to meet customer reliability requirements.
  • Authorized to make decisions and recommend to HQ to issue component level and Board Level Reliability qualification reports along with on-going reliability report.
  • Issue internal processes, product and package qualification and evaluation project summaries and evaluate and perform Reliability Risk Assessment.
  • Lead reliability efforts that support new technology development, new tool qualification, and reliability-oriented design rule verification and development as required.
  • Initiate and report failure analysis of components from reliability testing.
  • Manage test schedules, priorities, and capacity/resources to assure all reliability assessment and qualification testing is completed on time.
  • Drive continuous improvement and operational excellence; increase operational efficiency through standardization, automation and optimum structuring of the lab systems and resources.
  • Manage the lab equipment and infrastructure, responsible for asset management, calibration, and preventive maintenance.
  • Drive and review Design for Reliability and Design for Test to ensure stress-ability and testability.
  • Lead all aspects of and ensure adequate preparation for qualification including such as corner skew material, BIB/Socket, waveform, electrical bias, thermal effect, lifetime estimation.
  • Implement POR of process flows, workmanship standards and supervise product performance.
  • Support PCN or ECN activities.
  • Any and all other duties, as assigned and maintains accountability for actions (ownership of work).

ESSENTIAL REQUIREMENTS

  • The ideal candidate shall have more than 15 years of hands-on experience in Component Level Semiconductor Reliability and Failure Analysis.
  • MS degree in Physics, EE (PhD preferred) with overall >15 years of experience in CMOS and power integrated component and Magnetic sensor products reliability assurance.
  • Demonstrated hands on experience of more than 10 years with electronic component reliability JEDEC/AEC-Q100 and associated standards a MUST.
  • Good working knowledge of CMOS and magnetic sensor semiconductor device physics.
  • >10 years hands on experience and knowledge of reliability stress and test methods, failure mechanism acceleration models, and ability to perform FIT rate calculations, interpret Mission Profiles, etc. is a MUST.
  • Good social and communications skills - comfortable working in multicultural teams.
  • >6 years of Failure analysis experience involving microprobing, various diagnostics tools such as emission microscopy, Scanning electron microscopy, delayering, as well as destructive physical analysis for process and product characterization.
  • Semiconductor engineering experience in the Reliability and/or Quality/Product Engineering role from multinational companies.
  • Experience in JEDEC reliability and quality related standards, ISO, and the science behind them.
  • The ideal background will have experience of silicon product level reliability qualification and lifetime behavior model and well versed and knowledgeable on reliability fail modes of silicon/packaging technologies and fail mechanisms with respect to reliability.
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Confirmed 18 hours ago. Posted 30+ days ago.

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