Micron

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR52631 Low Power DRAM Platform Integration Engineer

As an LPDRAM TPM Engineer, you are expected to create, compile and own the unified IC packaging Roadmap to the product development teams for specific customers and applications as a part of the Global Package development organization. You will need a visionary approach to define the new product portfolios and new architectures that are being solicited by the you (TPM) from customers and Micron’s internal Business units.

Job Responsibilities: 

• Integrate the requirements from multiple customers and SOC vendors, and interact with internal and external process integration teams with a goal to develop and qualify the new technology building blocks prior to the product NPI.
• Define the enablement projects needed to achieve the planned Roadmaps with clear expectations and timelines communicated to the TD and NPI teams.
• Work closely with design and SIPI teams to define the optimal Package solution
• Define the success criteria, as well as provide initial inputs for the design rules, dFMEA / pFMEA and control plan needed for package NPIs. 

Requirement/Skills: 

• Taiwan Citizen or authorized to work in TW
• 10+ years experience in IC pkg field with Grad degree in related engineering field.
• Strong communication skills, and good work ethics
• A structured approach to problem solving. 
• Fundamental understanding of IC packaging design, materials and processes
• Informative knowledge of industry trends in Advanced Packaging and working level knowledge in SIPI and PDN.
• English language spoken and written comprehension.
• Helping establish memory design window for various applications, by leveraging the x-functional team talent and architecting solution around various design trade-offs for memory design.
• Understanding of the design impact and key pkg parameters that may affect the Eye diagram opening.
• Understanding of Memory and Storage differences (DRAM vs NAND/NOR) in device level operation and key packaging challenges based on different applications.
• Familiar with statistical approach in engineering and design of DOEs

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.