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Company:

Qualcomm China

Job Area:

Interns Group, Interns Group > Interim Engineering Intern - Test

General Summary:

Main Responsibilities:

Responsible for development of bench H/W & S/W for IC product testing, e.g., RF and analog testing on bench test board. Own chip characterization, verification, correlation, failure analysis for NPI product, and supporting failure analysis of test rejects of RMA. Analyze test data from ATE and bench level; Perform deep debug on test hole issue.

Duties/Responsibilities:

  • Help engineer setup RF and Mixed-signal Bench platform;
  • Collect RF and Mixed-signal chips bench test data.
  • Help engineer analysis and summarize test data. 

Skills / Experience Required:

  • Good communication skills in English
  • Highly motivated, fast learner, team player with good communication skills
  • Understanding of RF circuit & Mixed-Signal IC as a plus
  • Preferred with RF (WiFi, Bluetooth) system-level or IC testing as a plus
  • Familiar lab instruments/tools (Oscilloscope, Spectrum analyzer, IQview, DMM, Network Analyzer, Signal Generator, etc.) as a plus
  • Experience on software programming with assembly, C/C++, or scripting language as a plus

Education Requirements (Degree Major, GPA, Courses)

  • BS Electrical Engineering, Microelectronic, or Computer Engineering, MS preferred

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If you would like more information about this role, please contact Qualcomm Careers.

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Confirmed 9 hours ago. Posted 9 days ago.

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