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Job Details:

Job Description: 

You will be working as a member of Intel Optane Group (IOG) in the SSD Quality and Reliability team.

The candidate will be part of IOG Quality and Reliability team responsible for product development engineering, qualification, and support of Intel's revolutionary high performance Optane Solid State Drives and DIMMs.

The HW Debug and Failure Analysis Engineer will be responsible for but not limited to:

  • Failure reproduction and segmentation using system and FW logs along with bench methods.
  • Fault isolation and identification of failing component or location for further physical analysis.
  • Familiar with analytical tools such as Parametric Analyzer (IV analysis), 2-wire and 4-wire measurements, TDR, SEM/EDX, FIB, IREM, X-Ray, Acoustic Imaging, IR imaging, mechanical and chemical sample preparation and others to understand the failure mode and mechanism.
  • Publishing analytical reports with established failure mechanisms, potential root causes and recommending corrective actions to prevent reoccurrence of problems.
  • Work with partners organizations e.g. Manufacturing Engineers, Product/Quality Engineering, Firmware, Material, and IOG's OSAT/ODMs, etc. to ensure adequate quality/reliability of Intel-branded SSD/DIMM modules.
  • May be expected to lead small cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues- such as, during technology development and ramp to high-volume manufacturing.
  • Systematic analytical problem solving.
  • Understand the high-level picture and apply systems thinking to generate solutions

Qualifications:

Minimum qualifications:

The candidate must possess at least one of the 2 following degrees plus the years of experience determined for each degree in the areas specified below:

  • Bachelor's degree in Material Sciences, Microelectronics, Electrical Engineering, Chemical, Physics or related field of study and 5+ years of industrial experience OR
  • Master's degree in Material Sciences, Microelectronics, Electrical Engineering, Chemical, Physics or related field of study and 2+ years of industrial experience.

Preferred Qualifications:

  • Experience with Python SV validation environment.
  • Experience on Non-volatile memories, especially product or validation engineering.
  • Experience with PC/Memory/Platform Architecture, SSDs or HDDs.
  • Computer programming for data acquisition, reduction and analysis experience.
  • Semiconductor fabrication process, packaging assembly and testing, and/or board system technology operation experience..
  • Experience in digital/analog circuit knowledge and/or good test methodology coding and/or failure analysis experience.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Business group:

In the Design Engineering Group (DEG), we take pride in developing the best-in-class SOCs, Cores, and IPs that power Intel’s products. From development, to integration, validation, and manufacturing readiness, our mission is to deliver leadership products through the pursuit of Moore’s Law and groundbreaking innovations. DEG is Intel’s engineering group, supplying silicon to business units as well as other engineering teams. As a critical provider of all Intel products, DEG leadership has a responsibility to ensure the delivery of these products in a cost efficient and effective manner.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.

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Confirmed 17 hours ago. Posted 19 days ago.

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