Come intern with one of the largest engineering companies in the world.
Intel's Technology Development Component Research (TD CR) delivers innovative semiconductor and packaging technologies research and development. The group focuses on unique, enabling capabilities across all aspects of Intel's semiconductor processing and packaging roadmap.
Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials, and integration schemes across a wide variety of novel applications.
The Components Research (CR) team is looking for a passionate intern to join our team as a memory device engineer working with CR's device engineers, memory experts, process engineers and circuit designers. This internship will require some level of device and circuit modeling, scientific analysis, problem solving, effective communication, and collaboration within the team. Final scoping of project will be determined based on intern experience and business needs.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Requirements:
Minimum of 12+ months experience in:
Preferred Qualifications:
Student / Intern
Shift 1 (United States of America)
US, Oregon, Hillsboro
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
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