Raytheon

The Product Technology Center in the Electrical Subsystems Directorate is seeking a Circuit Card and Component Design and Analysis Engineering Fellow that is responsible for supporting the design, manufacture, and failure analysis of advanced electrical subsystems in support of new product development, legacy re-spins, and production hardware at Raytheon Missiles & Defense (RMD). The selected candidate will lead teams in defining circuit card design solutions, being responsible for performance and cost, and supporting these products through their development, implementation, verification, and maintenance. Additionally, they will be responsible for shaping circuit card and component development strategy for RMD, including road maps for Product Lines and new manufacturing related technologies. The candidate shall demonstrate expertise in all of the components that are necessary for developing a circuit card assembly including experience in how these systems interact with the overall guidance unit. These include but are not limited to expertise in structural design/analysis, system survivability in extreme environments, mechanical interactions and design, and system performance modeling.

The selected candidate will be required to effectively interact with engineers across multiple disciplines including systems, mechanical, component, design for excellence, manufacturing engineering, material engineering, system test, and system verification. The selected candidate will be expected to effectively present their work in program and Business Unit reviews and to provide expert counseling and mentoring. They will be expected to lead teams and provide technical oversight and task delegation as appropriate. The customers of this position will include internal personnel and programs, as well as external Government(s) personnel and programs. The selected candidate will work with the customer and engineering leadership to define design requirements to validate and to verify that hardware being designed is compliant with requirements. The selected candidate will be required to interact with suppliers, often needing to visit supplier facilities to review and diagnose production, assembly, and development issues and provide technical solutions.

As a Fellow, it is expected that the candidate work across Product Lines and Business Units as dictated by the critical needs of the Enterprise. Additionally, the Fellow will seek out and establish apprenticeships to enable a teaching culture at RMD. In this position, they must have exhibited a proven track record with national recognition of circuit card assembly and component engineering knowledge as it pertains to developing products and working across a product’s life cycle. The candidate of choice will encompass a history of design innovation validated by patents and technical papers, serving as the expert through integration and qualification of electrical subsystems, and leading Failure Investigation Teams in resolution to complex production sustainment issues and / or electronics anomalies.

Key Responsibilities:

• Lead selection of circuit card and component design solutions for Raytheon Missiles & Defense is electrical products with considerations for its role in the system, all phases of engineering and production, and the product life cycle.
• Lead trade studies on various electrical subsystems.
• Support modeling and simulation activities.
• Lead development of requirements in support of circuit card and component environmental survivability and the requirement flow to components.
• Drive the development, implementation, verification and maintenance of component and circuit card design in close collaboration with other disciplines to provide a mature optimized missile product
• Identify strategic manufacturing and engineering development opportunities for Circuit Cards and Components
• Propose and lead independent research and development (IRAD) projects for the advancement of circuit card assembly and component engineering solutions
• Ensure balance of risk, performance, and cost.
• Be accountable to leadership for technical decisions.
• Participate in major technical review boards, e.g., Failure Review Board
• Communicate and collaborate with Program Management and Technical Leadership, Engineering Leadership, Manufacturing, Suppliers, and Customers.
• Guide, apprentice, mentor, and train colleagues within the component, PCB, and CCA development design area

Required Skills/Experience:

• A minimum of 12 years of manufacturing, analysis, and circuit card manufacturing or component engineering experience and their associated electrical subsystems
• Strong experience in interconnect technology – BGAs, microvias, flex, rigid flex, embedded passives, wirebond, chip scale packaging, embedded coins, and connector technologies
• Experience with manufacturability and performance of PCBs/Materials – High Tg FR4, copper foils, Ceramic Filled Teflons, PPO laminates, mixed materials, CTE effects, reliability interactions, via reliability, pad cratering, and embedded passive elements
• Experience with and an understanding of the impact of design choices on manufacturing costs – Cost modeling, process knowledge, quality costs, assembly cost drivers, fabrication cost drivers, manufacturing capacity ramps, and process improvements
• Experience with and an understanding of Silicon/Packaging – BGA pattern optimization, package venting, fan-in/fan-out packaging, stacked modules, silicon interposers, embedded die, package and silicon integration, reliability, manufacturing care-abouts, CTE concerns, and thermal management
• Experience in Layout/Signal Integrity for circuit card design and component interaction – Constraint management, layout optimization, impedance modeling, optimized I/O placement, and optimal PWB stack-up
• Experience in Supplier Development and Assessments - Supplier qualification, selection, quality systems, audits, strategic sourcing, and roadmap alignment
• Strong experience leading technical teams
• Existing, or the ability to obtain, a DoD-issued Secret Security Clearance (US Citizenship is required)

U.S. Citizenship status is required as this position needs an active U.S. Security Clearance as of day one of employment.

Required Education (including Major):

Bachelor's Degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Material Science, Industrial Engineering or other related disciplines.

Desired Skills:

• Additional background in supply chain management, sales, and program management would be beneficial
• Experience in leadership and or senior engineering roles
• Experience within the aerospace industry
• Active DoD issued Top Secret security clearance
• Demonstrated ability to influence others to achieve technical and programmatic goals
• Demonstrated proactive problem solving experience
• Demonstrated ability to develop a business strategic vision and execute changes
• Demonstrated ability to write successful technical proposal volumes
• Demonstrated written and verbal communication ability to leadership

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Raytheon is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, age, color, religion, creed, sex, sexual orientation, gender identity, national origin, disability, or protected Veteran status.