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Description:

  • Work with worldwide cross-functional teams on new silicon development from early phases of product definition onwards.
  • Develop and support debug of Probe and FT test solutions, including Probe and FT test hardware designs, that result in both product cost and product quality requirements being met.
  • Develop and validate of new silicon on BACES system.
  • Support silicon Matrix Characterization plus initial data analysis, customer sample deliveries and product reliability qual.
  • Apply knowledge and skills to help drive Product yields, test times and test coverage, to industry benchmark levels.
  • Learn best known problem solving approaches and methods to work with Design, Applications, and Manufacturing teams to solve New Product introduction challenges.
  • Besides project execution, there are different work groups on improving test methodologies and test efficiency. 
  • Execute the Reliability stress to qualify a new product and package, support NTI certification for new technologies.
  • Customer Quality incident resolution in NPI phase
  • Define test requirement to maximize the on-chip test coverage
  • Determine Tester Platform/Configuration to meet product requirements with manufacturing

Requirements:

  • Bachelor or above in study with EE (Master is preferred), Communication or Automation related major.
  • Good skill at C/C++ or any other code experience is preferred.
  • Excellent communication and interpersonal skills in both English (CET-6) and Mandarin require to liaise with US and Europe.
  • Experience/Education in Project Management will be an advantage.
  • Willing to learn, take on challenges and self-motivated.

More information about NXP in Greater China...

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Confirmed 17 hours ago. Posted 30+ days ago.

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