AMD

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

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THE ROLE:

We are looking for a Senior Signal & Power Integrity Packaging Engineer to join our growing team. As a key contributor to design the of AMD’s AECG FPGA product, you will be part of a package design team to work with cross function team to design or deliver the highest quality product to customer. You will be responsible design quality and ensure teamwork success, you and team will continue to develop, and product improve, we also encourage technical innovation to showcase successes as well as facilitate continuous career development.

THE PERSON:

As a member of the SI/PI package design engineer , you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package substrate design. You will be required to communicate effectively and work in close collaboration with others in AMD to ensure optimal engineering design decisions and efficient problem solving.

KEY RESPONSIBILITIES:

• Perform package extraction for the time domain and frequency domain analysis
• Provide design guidelines for the Package design
• Power integrity analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis (ADS, HSPICE) to meet the silicon noise spec, decoupling strategy and analysis.
• SSN(Simultaneous Switching Noise) analysis for I/O (DDR5, LPDDR5, etc.) power domain.
• Eye diagram and jitter analysis for die-package-PCB co-simulations.
• Signal integrity simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise.
• Work with SI/PI engineer for optimizing electrical performance including substrate s-parameter PDN/SSN/X-talk/IL/RL/Inductance/EM.
• Work with silicon architecture, substrate layout designer to create BGA ball map for layout feasibility & PCB routing.

PREFERRED EXPERIENCE:

• 3-5+ years relevant work experience in SI/PI field.
• Solid background in fundamentals of SI, PI, circuit, and transmission-line theory.
• Familiar with Cadence SigrityI, Ansys HFSS & Redhawk, Keysight ADS,Cadence Allegro, Ansys Q3D, and Synopsys Hspice
• Possesses an understanding of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trends to drive package design validation throughout all phases of the product cycle
• Understand in-depth package development flow and work fluently with NPI process to synthesize a cohesive package introduction plan
• Interface and negotiate effectively across engineering teams to balance performance adequacy and schedule commitment
• Drive package design review, manage modeling/simulation projects, prepare and present the final design review (FDR) to all product partners
• Collaborate with silicon IP and package technology teams to establish the development plan and timeline for the R&D project, test vehicle, and prototype packages
• Industry experience in IC package technology and product development in the semiconductor industry with consistent track record
• Demonstrate technical leadership in complex product development under challenging technical and schedule conditions

ACADEMIC CREDENTIALS:

• Bachelor's or Master’s degree in Electrical or Microwave Engineering or a related field.

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Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.