Micron

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron currently has an opening for advance HBM4 package integration engineer and located in Taichung. As a HBM package integration engineer you will be part of the PI group responsible for driving development and introduction of new process solutions to the HBM (high bandwidth memory )that will be implemented in advanced stacked DRAM memory products. And subsequent improvement in for electric yield and electric /physical failure analysis , dig-out root cause to help process engineer to fix it and transfer to mass production.

IN ABOVE RULE, SUCCESSFUL CANDIDATES for THIS POSITION MUST DEMONSTRATE:

• Responsible for HBM project (high-bandwidth memory) yield calculation for process improvement and co-work with team for automation script development.
• Utilize statistical tools for detailed data analysis for electric yield improvement projects
• Work with the wafer fab ,post wafer finish (Bumping), Assembly process/integration group to address process-related defects affecting electric yield
• Work closely with probe and test related groups.
• Use project management skills to ensure timely completion of projects
• Own the assembly portion of the product manufacturing process flow during development of new product introduction (NPI) in MTB
• Work closely in conjunction with the APTD process team to set-up experiments using DOE, monitoring progress of changes, and statistical analysis of results
• Publish module updates, key project status updates, best known methods, and lessons learned

Basic requirement:

• Masters or Bachelor’s degree in Engineering
• Strong logical thinking, as applied to general programming, problem solving and issues debugging capabilities.
• Basic Semiconductor manufacturing process (Front-end wafer process / Wafer Probe / Back-end assembly process / Back-end Test Either one, the more the better)
• PKG reliability understanding
• Skills and proficiency in statistical analysis/method like JMP or TABALU /EDA analytic tools
• Prior experience with yield analysis or enhancement would be advantageous.
• Strong written and verbal communication skills,

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.