Designs and analyzes mechanical systems, equipment and packaging for platform wafer handling systems across Lam product portfolio (etch dep and clean). Conducts feasibility studies and testing on new and modified designs. Directs support personnel in the preparation of detailed design, design testing and prototype fabrication. Provides design information to drafting for packaging documentation. Interfaces with software, controls, and electrical engineers, and product/program management teams as well as OEM suppliers of critical components.
Masters Degree in Mechanical Engineering required.